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cpu chip中文是什么意思

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  • 例句與用法
  • Development of cpu chip package technology
    芯片封裝技術的發(fā)展演變
  • The development of cpu chip package technology
    芯片封裝技術的發(fā)展
  • Registers on a given cpu chip that store very low - level information
    給定cpu芯片上存儲非常低級別信息的寄存器。
  • This paper presents the logic circuit design of ccu for lx - 1164 cpu chip , for ccu , data and instructions are stored in separate data and instruction caches
    本人有幸在夏宏博士的指導下參加這一工程,承擔lx ? 1164cpu的高速緩存控制器( ccu )的邏輯設計和功能仿真。
  • I guess the most notable thing is putting the memory controller on the cpu chip , which has already been done by the alpha people , and has already been shown to have upsides and downsides
    我想最值得注意的就是將存儲器控制器放到cpu芯片上,這一點開發(fā)alpha的人員已經(jīng)使用了,而且已經(jīng)表現(xiàn)出有利也有弊。
  • The higher the processing speed of computer , the more heat generating from cpu chip . if the heat ca n ' t be dissipatied effectively , the processing stability and speed will be decreased dramatically
    計算機運行速度越高其芯片cpu發(fā)熱量越大,如果這些熱量得不到有效散逸,會制約芯片速度的進一步提高。
  • In order to fit the demand for future high speed cpu chip whose running heat flux reaches to 100 - 1000w / cm2 , the development of an efficient cooling technology has become the update key projects all over the world
    針對熱流密度高達100 ? 1000w / cm2的高速cpu芯片,開發(fā)有效的冷卻技術,是當今世界正在研究的重要課題。
  • Dsp products used primarily multi - cpu chips and parallel processing technology , to develop a series of products has been widely used for electricity , communications , transportation , national defense and generating new energy fields
    主要產(chǎn)品采用dsp芯片及多cpu并行處理技術,開發(fā)出的系列產(chǎn)品已廣泛應用于電力、通信、交通、國防及新能源發(fā)電等領域。
  • But when the wind - speed becomes above 1m / s hereafter , wind - speed increase for the cpu thermal siphon of transmit heat the ability ' s gain result the deceleration . so it is considered perfect when the wind - speed is 1m / s . through this experimentation we found that when the cpu thermal syphon cooling machine used acetone as working fluid , wind - speed 1m / s , cpu chip caloricty 60w , its volumetric heat release rate came to 1 . 3 104w / ( m3k )
    通過本次實驗測出所使用的cpu重力熱管散熱器在使用丙酮為工質(zhì),風速1m / s , cpu芯片發(fā)熱量為60w時,其體積散熱率達到1 . 3 104w / ( m3k ) ,能保證芯片溫度與環(huán)境溫度之差小于40 ,能很好的適應pentium -計算機長期運行的要求。
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